VIEWZOM PCB Solder Paste Inspection Machine
Advanced Automated Optical Inspection System
₹3200000.00
Out of stock
SPI (Solder Paste Inspection) Machine – Typical Specifications
Specification | Typical Value |
|---|---|
Machine Type | Inline 3D Solder Paste Inspection (SPI) |
Inspection Technology | Structured Light / Moiré / Phase Shift 3D Measurement |
Camera Resolution | 10–25 MP Industrial Camera |
XY Resolution | 10–20 μm |
Z Resolution | 0.5–1 μm |
Volume Accuracy | ±2% |
Height Accuracy | ±1–3 μm |
Smallest Component | 01005 (Metric) |
PCB Size | 50 × 50 mm to 510 × 510 mm (model dependent) |
PCB Thickness | 0.4–6 mm |
Conveyor Height | 900 ± 20 mm |
Inspection Speed | Up to 80–120 cm²/s |
Programming | CAD/Gerber Import, Golden Board, Auto Programming |
Barcode Reading | 1D/2D Barcode, QR Code |
Communication | SMEMA, IPC-CFX, MES |
Operating System | Windows-based Industrial PC |
Power Supply | AC 200–240 V, 50/60 Hz |
Air Supply | 0.45–0.6 MPa Clean Dry Air |
Inspection Parameters
A 3D SPI system measures:
Solder paste Volume
Paste Height
Paste Area
X/Y Offset (Misalignment)
Shape
Coplanarity
Bridging
Insufficient solder
Excess solder
Smearing
Missing paste